JPS6138218Y2 - - Google Patents
Info
- Publication number
- JPS6138218Y2 JPS6138218Y2 JP1981077613U JP7761381U JPS6138218Y2 JP S6138218 Y2 JPS6138218 Y2 JP S6138218Y2 JP 1981077613 U JP1981077613 U JP 1981077613U JP 7761381 U JP7761381 U JP 7761381U JP S6138218 Y2 JPS6138218 Y2 JP S6138218Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- lead
- board
- circuit unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 11
- 238000007789 sealing Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981077613U JPS6138218Y2 (en]) | 1981-05-29 | 1981-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981077613U JPS6138218Y2 (en]) | 1981-05-29 | 1981-05-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57191069U JPS57191069U (en]) | 1982-12-03 |
| JPS6138218Y2 true JPS6138218Y2 (en]) | 1986-11-05 |
Family
ID=29873264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981077613U Expired JPS6138218Y2 (en]) | 1981-05-29 | 1981-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6138218Y2 (en]) |
-
1981
- 1981-05-29 JP JP1981077613U patent/JPS6138218Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57191069U (en]) | 1982-12-03 |
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